Showing 1 - 20 results of 43 for search 'PACKAGING DESIGN AND PRODUCTION', query time: 0.79s Refine Results
  1. 1
    by Shu-yuan Lin, 林淑媛
    Published 2012
    ... to construct a prediction model for the influence of packaging design effects on value association, product...
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  2. 2
    by Hsiao-Chien Huang, 黃筱茜
    Published 2013
    ... always been known as the local product of Xingang Township, Chiayi County, but the packaging design...
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  3. 3
    by Wan-Yu Huang, 黃宛玉
    Published 2007
    ... packaging of components and products reliability and yield. In this study, our main goal is investigated...
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  4. 4
    by Yu-chen Wu, 吳瑜晨
    Published 2007
    ... electronic products had already became popular in the whole world, like the note book, the mobile phone...
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  5. 5
    by Yi-kuan Pao, 包一匡
    Published 2006
    ... business of IC Packaging and Testing industry is OEM service, and its most famous characteristics...
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  6. 6
    by Wan-chien Huang, 黃婉茜
    Published 2007
    ...”, “Weidan” and “Yes” as the objects in this study; 3 different types of packaging design were selected among...
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  7. 7
    by Huei-jiun Tang, 湯惠君
    Published 2012
    ... interviews with industry experts, we found HANNSpree’s emphasis on creative product designs and its attempts...
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  8. 8
    ... in the reflow behavior and the package warpage . It designed different reflow temperatures with a series of Sn...
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  9. 9
    by Kuan-yu Chen, 陳冠宇
    Published 2010
    ... is the key to affect this industry. IC packaging process is divided into a leadframe packaging products...
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  10. 10
    by Lu-Qing Chen, 陳陸慶
    Published 2004
    ... Business Value Chain System and build up the standard of product design. To answer above questions...
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  11. 11
    by Teng-hung Chen, 陳騰鴻
    Published 2008
    ...-in Package (SiP) has been the most popular package styles in the IC industries in the past decade. Because...
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  12. 12
    by Jiunn-Rong Perng, 彭俊榮
    Published 2003
    ... diversified products. Group Inclusive Package Tour is one of the choices that are generally acceptable...
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  13. 13
    by Tzu-Jen Lin, 林子仁
    Published 2005
    ... the same trend. The BGA (Ball Grid Array) package, designed for more I/O pins, is more popular nowadays...
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  14. 14
    by Pey-Yu Chen, 陳佩瑜
    Published 2010
    ... the impacts so as to provide the basis for buffering package design. When the construction is impacted...
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  15. 15
    by Chun-Yu Lee, 李俊右
    Published 2010
    ... the driver IC and glass substrate via ACF of COG package. Several types of driver ICs with different bump...
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  16. 16
    by Jia-han Li, 李佳翰
    Published 2007
    ... for engineers to design similar products. ...
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  17. 17
    by Tsung-Kuei Lin, 林聰貴
    Published 2009
    .... With deferred production, IC design houses can offer different production type upon customer category to meet...
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  18. 18
    by Tsan-Jung Yang, 楊璨榕
    Published 2008
    ... for Sung Dynasty art into jewelry design. The purpose of study is to provide the value-added application...
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  19. 19
    by Jing-Yu Kuo, 郭靜羽
    Published 2009
    ... and packaging. Because tea products are healthier, there are more and more people enjoying consuming them. As a...
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  20. 20
    by Chien-hung Liu, 劉建宏
    Published 2014
    ... customers’ preference for product purchases or solution purchases while purchasing process instruments for a...
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