-
1“... and improve products yield rate are the main issues for packaging. This research uses a semi-automatic EMC...”
Get full text
Others -
2“... to the failure of IC packaging, low productivity, poor reliability, etc. Therefore, the current issues which...”
Get full text
Others -
3“...碩士 === 國立成功大學 === 工程科學系碩博士班 === 100 === During the process of electronic IC packaging, epoxy...”
Get full text
Others -
4“... products, including defective edge and uneven surface, which might result in the failure of packaging, low...”
Get full text
Others -
5“..., high speed, low power production on the advantages of the device will be used to wafer bonding...”
Get full text
Others -
6“... and specimen coating and improve products yield rate are the main issues for packaging. This research...”
Get full text
Others -
7“...碩士 === 國立成功大學 === 工程科學系碩博士班 === 91 === In IC packaging, when epoxy molding compound（EMC）is filling...”
Get full text
Others -
8“...碩士 === 國立成功大學 === 工程科學系碩博士班 === 97 === In IC packaging, when epoxy molding compound (EMC) is filled...”
Get full text
Others -
9“...碩士 === 國立成功大學 === 工程科學系碩博士班 === 98 === In IC packaging, when epoxy molding compound (EMC) is filled...”
Get full text
Others -
10“... rapidly, from integrated circuits to the electronic packaging and other industries. The thin film...”
Get full text
Others -
11“..., package designer can do a better design for process impact problem improvement before production. ...”
Get full text
Others -
12“... product during ejection and cause the package to fail and decrease the product quality and reliability...”
Get full text
Others -
13“... package of deformation. As people today have increasing demands for slim and light electronic products...”
Get full text
Others
