Showing 1 - 20 results of 116 for search 'PACKAGING PRODUCTION', query time: 0.86s Refine Results
  1. 1
    by JEN-CHI TENG, 鄧仁棋
    Published 2010
    ... experiences on the electronic packaging products, this study uses the techniques of data mining...
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  2. 2
    by Yi-kuan Pao, 包一匡
    Published 2006
    ... business of IC Packaging and Testing industry is OEM service, and its most famous characteristics...
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  3. 3
    by Kung-Wei Lu, 盧功偉
    Published 2011
    ... of Deployment, packaging and production technology, to enhance consumers to buy packaged tea beverage...
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  4. 4
    by Yu-Fen Chen, 陳玉芬
    Published 2007
    ... technology and the keen competition among enterprises, many similar products can be found in the market...
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  5. 5
    by Shu-Hung CHou, 周書弘
    Published 2013
    ... packaging materials, focusing on the preparation of vinyl-polysiloxane resin (MMviQ Resin...
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  6. 6
    by Shu-yuan Lin, 林淑媛
    Published 2012
    ... to construct a prediction model for the influence of packaging design effects on value association, product...
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  7. 7
    by Kuan-yu Chen, 陳冠宇
    Published 2010
    ... is the key to affect this industry. IC packaging process is divided into a leadframe packaging products...
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  8. 8
    by Hsiao-Chien Huang, 黃筱茜
    Published 2013
    ... always been known as the local product of Xingang Township, Chiayi County, but the packaging design...
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  9. 9
    by Jiunn-Rong Perng, 彭俊榮
    Published 2003
    ... diversified products. Group Inclusive Package Tour is one of the choices that are generally acceptable...
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  10. 10
    by Lu-Qing Chen, 陳陸慶
    Published 2004
    ..., the study firstly collected some technical data about packaging product from 30 packaging industries...
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  11. 11
    by Pang-wei Kuo, 郭邦暐
    Published 2014
    ... package size product flip-chip assembly process. Warp-age is a major concern in back-end process like ball...
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  12. 12
    by Teng-hung Chen, 陳騰鴻
    Published 2008
    ...-in Package (SiP) has been the most popular package styles in the IC industries in the past decade. Because...
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  13. 13
    by Wan-Yu Huang, 黃宛玉
    Published 2007
    ... packaging of components and products reliability and yield. In this study, our main goal is investigated...
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  14. 14
    by Hung-Wei Kuo, 郭鴻韋
    Published 2012
    ...碩士 === 逢甲大學 === 經營管理碩士在職專班 === 100 === In the recent years, the multi-package equipment industry...
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  15. 15
    by Yu-chen Wu, 吳瑜晨
    Published 2007
    ... electronic products had already became popular in the whole world, like the note book, the mobile phone...
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  16. 16
    by Tzu-Jen Lin, 林子仁
    Published 2005
    ...碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 93 === The development of electronic product is toward lighter...
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  17. 17
    by Rainbow Chen, 陳虹煌
    Published 2001
    ...碩士 === 國立中山大學 === 資訊管理學系研究所 === 89 === 論文摘要 (英) In the IC packaging and testing industry, short...
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  18. 18
    ... of system approach is challenging the managers of production line, they have to tell correctly and instantly...
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  19. 19
    by Chuan-Ying Wu, 吳權穎
    Published 2004
    ... cycles of the products are correspondingly reduced. To reduce the cost and earn the profit, the products...
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  20. 20
    by Pey-Yu Chen, 陳佩瑜
    Published 2010
    ..., and household electronic appliances on the buffering package made of composite materials. Composite honeycomb...
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