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1“... components using 3D-IC technologies. Because of THz wavelength between 10μm and 1000μm, the order of optical...”
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2“..., but the fabrication process becomes more efficient and less time consuming. Among the technologies of 3D IC...”
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3“... are approaching the physical limits, the semiconductor industry urgently requires some new technologies to expand...”
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4“... in development of temporary bonding and permanent bonding for bonding technology in 3D integration. Due...”
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5“... (Monolithic 3D-IC) is one of the key research in the development of the semiconductor industry. The distance...”
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6“... integrated circuits (3D IC). It has high material selectivity and high semiconductor process compatibility...”
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7“..., the bonding technology is the key process of 3D ICs fabrication. By the bonding technology, the connection...”
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8“... of the promising approach in keeping up with Moore’s law in the semiconductor field. Some of the key technologies...”
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9“.... In this research, the ultra-high-resolution demand is satisfied with the silicon semiconductor standard process...”
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10“... in semiconductor industry with low resistivity and high electro-migration resistance, has been developed for 3D...”
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