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1“... of this dissertation, we try to link semiconductor processes and adapt them to work with gaphene. Chapter 1...”
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2“...博士 === 國立交通大學 === 科技管理研究所 === 99 === Researches of technology or product diffusion models have been...”
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3“..., and Transfer, is presented as the framework of adopting emerging technology and innovation at a semiconductor...”
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5“...碩士 === 國立交通大學 === 工業工程與管理系所 === 96 === Introduction of new technologies/products plays an important...”
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6“...碩士 === 國立交通大學 === 資訊學院碩士在職專班資訊組 === 98 === Semiconductor manufacturing is an expensive investment...”
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8“... semiconductor devices are fabricated by solution process, including space-Charge-Limited Transistor (SCLT...”
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9“... the supercritical fluid technology to remove the moisture absorbed in carbon nanotube emitters. From experimental...”
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10“... related to semiconductor SCM key processes. In order to drive SCM successful, this research, based...”
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11“.... The study uses process perspective, instead of content perspective, that treats technology evaluation...”
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13by Ivan, Jebakumar, D SSubjects: “...Optoelectronic Devices Semiconductor...”
Published 2018
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14“...碩士 === 國立臺北科技大學 === 工業工程與管理系碩士班 === 105 === In recent years, the technology of semiconductor...”
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15“... normalized so that data of different products belonging to the same processing technology can be aggregated...”
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16TECHNOLOGICAL INNOVATION IN THE SEMICONDUCTOR INDUSTRY: ITS RELATION TO R & D SUBSYSTEM WORK CLIMATEby Abbey, AugustusSubjects: “...Semiconductor industry -- Technological innovations -- Management....”
Published 1981
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17Study on the application of supercritical CO2 in semiconductor processing and Field Emission Devices“... and process integration of low dirlrctric constant material HSQ (hydrogen silsesquioxane) and Supercritical CO...”
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18“... in the semiconductor packaging industry. In view of this, this paper attempts to construct a quality improvement system...”
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19“... materials. Copper manufacturing technology has been developed with damascene process. It would...”
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20“...-semiconductor (CMOS) RF process. We design several structures to reduce the sources of DCR of SPAD device...”
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