Suggested Topics within your search.
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TK Electrical engineering. Electronics Nuclear engineering
18
Substrates
4
Aspect ratio
3
Etching
3
II-VI semiconductors
3
T Technology (General)
3
Thin-films
3
Wide band gap semiconductors
3
Zinc oxide
3
Adsorption
2
Alumina
2
Aluminum oxide
2
Costs
2
Deformation
2
High aspect ratio
2
III-V semiconductors
2
MIPI DSI
2
Morphology
2
Semiconductor devices
2
Silicon carbide
2
TP Chemical technology
2
Thin films
2
analog signal processing
2
design optimization
2
energy consumption
2
packet alignment
2
Acoustic surface wave devices
1
Acoustic waves
1
Acoustics waves
1
Activation analysis
1
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161by Masashi Miyakawa, Mitsuru Nakata, Hiroshi Tsuji, Yoshihide Fujisaki, Toshihiro Yamamoto“...Solution-processed oxide semiconductors are promising candidates for the low cost, large scale...”
Published 2016-08-01
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162by Nilgianskul, Tan“...Thesis: M. Eng. in Manufacturing, Massachusetts Institute of Technology, Department of Mechanical...”
Published 2017
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163by Ruddick, Todd Andon“...Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Aeronautics and Astronautics...”
Published 2007
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164by Barrett, Todd“...Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1996...”
Published 2007
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165“.... As the process technology continues updating with evolution, in Taiwan''s semiconductor industry...”
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166by Lee-Yeh Chiang, 姜禮業“... to the trend of having a higher density component and high pin count for the IC, the wire bonding process...”
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167
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168by 張耀文“... the many ways in the semiconductor industry for process quality improvement, FMEA techniques are best...”
Published 2014
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169The study of Maintenance Decision Support System for Semiconductor Back-end Processing Equipmentment“... and finance management need to match for each other. Because the equipment of semiconductor back-end...”
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170Study on the application of supercritical CO2 in semiconductor processing and Field Emission Devices“... and process integration of low dirlrctric constant material HSQ (hydrogen silsesquioxane) and Supercritical CO...”
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171“...) wastewater from a semiconductor plant by electrocoagulation was investigated. The CMP wastewater, as obtained...”
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172by Meharg, Paul F. A.“... mechanisms involved. To gain some understanding of the elementary processes involved in this technology...”
Published 2008
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173by Meharg, Paul F. A.“... mechanisms involved. To gain some understanding of the elementary processes involved in this technology...”
Published 2008
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174
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175by Xu, Ruolin, M. Eng. Massachusetts Institute of Technology“...Thesis: M. Eng. in Advanced Manufacturing and Design, Massachusetts Institute of Technology...”
Published 2018
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176by Sihang Xie, Xueqi Li, Yasi Jiang, Rourou Yang, Muyi Fu, Wanwan Li, Yiyang Pan, Donghuan Qin, Wei Xu, Lintao HouSubjects: “...semiconductor nanocrystal...”
Published 2020-06-01
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177“... in the semiconductor packaging industry. In view of this, this paper attempts to construct a quality improvement system...”
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178by Stefanov, Yordan“...Development of semiconductor technology over the last five decades has led to aggressive scaling...”
Published 2012
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179“... on difference loop mode in semiconductor packaging is presented. The wire sweep is the wire deformation often...”
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180“... competitive ability in semiconductor manufacturing. Early identification of the yield-loss causes for ramp-up...”
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