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    Influence of Substrate connection on dynamic-RON drift of 650 V packaged GaN HEMTs by M. Cioni, G. Giorgino, G. Cappellini, A. Chini, C. Miccoli, M.E. Castagna, A. Abbisogni, A. Contarino, F.A. Pizzardi, S. Smerzi, F. Iucolano

    Published in Power Electronic Devices and Components (2025-03-01)
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