Search Results - Fashun Yang

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    Analysis and Verification of Heat Dissipation Structures Embedded in Substrates in Power Chips Based on Square Frustums Thermal through Silicon Vias by Fengjie Guo, Kui Ma, Jingyang Ran, Fashun Yang

    Published in Micromachines (2024-02-01)
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  2. 2

    Simultaneously performing interlayer copper interconnecting and TSV filling in stacked chips at room temperature based on copper electroplating by Mengru Huang, Linhong Lu, Jingyang Ran, Fashun Yang, Kui Ma

    Published in AIP Advances (2024-07-01)
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