Search Results - Mei-Hsin Lo

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    Low temperature Cu–Cu direct bonding in air ambient by ultrafast surface grain growth by Yun-Fong Lee, Yu-Chen Huang, Jui-Sheng Chang, Ting-Yi Cheng, Po-Yu Chen, Wei-Chieh Huang, Mei-Hsin Lo, Kuan-Lin Fu, Tse-Lin Lai, Po-Kai Chang, Zhong-Yen Yu, Cheng-Yi Liu

    Published in Royal Society Open Science (2024-09-01)
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  2. 2

    Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu by Yun-Fong Lee, Chih-Wen Chiu, Chin-Yen Chiu, Yu-Chen Huang, Mei-Hsin Lo, Liu-Hsin-Chen Yang, Ting-Yi Cheng, Zhong-Yen Yu, Chih-En Hsu, Kai-Chi Lin, Po-Yu Chen, Wei-Cheih Huang, Jui-Sheng Chang, Shao-An Pan, Yi-Cheng Su, Chin-Li Lin, Hang-Chen Hsieh, Chia-Hua Lin, Cheng-Yi Liu

    Published in Scientific Reports (2025-08-01)
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