Search Results - Pengrong Lin

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  1. 1

    Achieving high-quality silver sintered joint for highly-reliable schottky barrier diodes via pressureless method by Chenyi Dai, Yong Wang, Pengrong Lin, Pengrong Lin, Zilin Hao, Chaoyang Wang, Xiaocheng Feng, Xueming Liu

    Published in Frontiers in Materials (2023-11-01)
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  2. 2

    Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder joints under thermal shock between 77 K and 423 K by adding TiO2 nanoparticles by Ruyu Tian, Yan Gao, Jiayue Wen, Pengrong Lin, Shimeng Xu, Yanhong Tian

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  3. 3

    Effects of electrodeposition current density and additives on the microstructure and mechanical properties of copper films by Xuefeng Wu, Xiuchen Zhao, Pengrong Lin, Chengwen Tan, Chaoping Wang, Weiwei Chen

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  4. 4

    Mechanical properties and microstructure evolution of Sn–Bi-based solder joints by microalloying regulation mechanism by Xuefeng Wu, Zhuangzhuang Hou, Xiaochen Xie, Pengrong Lin, Yongjun Huo, Yong Wang, Xiuchen Zhao

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  5. 5

    Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling by Xuefeng Wu, Zhuangzhuang Hou, Xiaochen Xie, Pengrong Lin, Yongjun Huo, Yong Wang, Xiuchen Zhao

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