Search Results - Seonghi Lee

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    Scalable and Fast Electrical Modeling Method for Bonding-Wire Memory Packages by Dongryul Park, Seonghi Lee, Seunghun Ryu, Hyunwoo Kim, Duksoo Kim, Hyunsik Kim, Jongwook Kim, Seungyoung Ahn

    Published in IEEE Access (2025-01-01)
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  2. 2

    A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory by Hyunwoong Kim, Seonghi Lee, Kyunghwan Song, Yujun Shin, Dongyrul Park, Jongcheol Park, Jaeyong Cho, Seungyoung Ahn

    Published in Micromachines (2022-07-01)
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