Search Results - Wenchao Tian

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  1. 1

    Effect of Surface Roughness on the Electrical Performances of CPW Transmission Lines Used in Future Ultra-High Frequency Applications by Zhiqiang Chen, Wenchao Tian

    Published in Micromachines (2022-12-01)
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    Article


  2. 2

    Molecular Dynamics Analysis of Graphene Nanoelectromechanical Resonators Based on Vacancy Defects by Wenhua Li, Wenchao Tian

    Published in Nanomaterials (2022-05-01)
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  3. 3

    Research Progress of Gas Sensor Based on Graphene and Its Derivatives: A Review by Wenchao Tian, Xiaohan Liu, Wenbo Yu

    Published in Applied Sciences (2018-07-01)
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  4. 4

    Shape Memory Polymer Composites of Poly(styrene-b-butadiene-b-styrene) Copolymer/Liner Low Density Polyethylene/Fe3O4 Nanoparticles for Remote Activation by Yongkun Wang, Junjie Ye, Wenchao Tian

    Published in Applied Sciences (2016-11-01)
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  5. 5

    Research of Vertical via Based on Silicon, Ceramic and Glass by Wenchao Tian, Sixian Wu, Wenhua Li

    Published in Micromachines (2023-07-01)
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  6. 6

    Visualization and Heat Transfer Performance of Mini-Grooved Flat Heat Pipe Filled with Different Working Fluids by Fei Xin, Qiang Lyu, Wenchao Tian

    Published in Micromachines (2022-08-01)
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  7. 7

    Research and Analysis of MEMS Switches in Different Frequency Bands by Wenchao Tian, Ping Li, LinXiao Yuan

    Published in Micromachines (2018-04-01)
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  8. 8

    The Deformation of a Liquid Metal Droplet Under Continuous Acceleration in a Variable Cross-Section Groove by Hanyang Xu, Haojie Dang, Wenchao Tian, Zhao Li

    Published in Micromachines (2024-12-01)
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  9. 9

    Thermal Performance Optimization of Integrated Microchannel Cooling Plate for IGBT Power Module by Hanyang Xu, Jiabo Huang, Wenchao Tian, Zhao Li

    Published in Micromachines (2023-07-01)
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    Article


  10. 10

    Height Uniformity Simulation and Experimental Study of Electroplating Gold Bump for 2.5D/3D Integrated Packaging by Wenchao Tian, Zhao Li, Yongkun Wang, Guoguang Zhang

    Published in Micromachines (2022-09-01)
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  11. 11

    A thermally activated VO2-based attenuator with SRR structure by Zhiqiang Chen, Yunqi Cao, Yuxiao He, Wenchao Tian

    Published in Materials & Design (2022-11-01)
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  12. 12

    The Study of the Reliability of Complex Components during the Electromigration Process by Hao Cui, Wenchao Tian, Yiming Zhang, Zhiqiang Chen

    Published in Micromachines (2023-02-01)
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  13. 13

    Characteristics of a novel thermal-induced epoxy shape memory polymer for smart device applications by Hao Cui, Wenchao Tian, Yu Kang, Yongkun Wang

    Published in Materials Research Express (2020-01-01)
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    Article


  14. 14

    Thermoelectric Responsive Shape Memory Graphene/Hydro-Epoxy Composites for Actuators by Yongkun Wang, Wenchao Tian, Jianqiang Xie, Yan Liu

    Published in Micromachines (2016-08-01)
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    Article


  15. 15

    Reliability Analysis of Complex PCB Assemblies Under Temperature Cycling and Random Vibration by Wenchao Tian, Feiyang Li, Mang He, Haoyue Ji, Si Chen

    Published in Micromachines (2025-02-01)
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    Article


  16. 16

    Three-Dimensional Integrated Fan-Out Wafer-Level Package Micro-Bump Electromigration Study by Wenchao Tian, Ran Gao, Lin Gu, Haoyue Ji, Liming Zhou

    Published in Micromachines (2023-06-01)
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  17. 17

    Research of Wafer Level Bonding Process Based on Cu–Sn Eutectic by Daowei Wu, Wenchao Tian, Chuqiao Wang, Ruixia Huo, Yongkun Wang

    Published in Micromachines (2020-08-01)
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    Article


  18. 18

    Temperature Cycle Reliability Analysis of an FBAR Filter-Bonded Ceramic Package by Wenchao Tian, Wenbin Li, Shuaiqi Zhang, Liming Zhou, Heng Wang

    Published in Micromachines (2023-11-01)
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    Article


  19. 19

    Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature Cycling by Wenchao Tian, Haojie Dang, Dexin Li, Yunhao Cong, Yuanming Chen

    Published in Micromachines (2024-07-01)
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  20. 20

    Photonic Integrated Circuits: Research Advances and Challenges in Interconnection and Packaging Technologies by Wenchao Tian, Yifan Wang, Haojie Dang, Huahua Hou, Yuanyuan Xi

    Published in Photonics (2025-08-01)
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