| الملخص: | HYDROMETALLURGY PROCESS FOR EXTRACTION OF COPPER PRESENT IN PRINTED CIRCUIT BOARDS USING HYDROGEN PEROXIDE AND ACIDS AS LEACHING AGENTS. With the increasing use of electronic devices and the reduction of their useful life, the generation of electronic waste has grown significantly. This study investigates the hydrometallurgical process of copper extraction from computer printed circuit boards, using hydrochloric acid and hexafluorosilicic acid, combined with hydrogen peroxide, as leaching agents. The process optimization was performed using response surface methodology, evaluating the influence of variables such as hydrochloric acid concentration, temperature and volume of hexafluorosilicic acid. Two factorial designs were conducted to analyze the significance of the variables. Temperature showed a positive influence, being fixed at 40 °C in the subsequent experiments. Hydrochloric acid concentration was identified as the most significant variable, with high extraction rates associated with higher concentrations of H3O+ ions. Using 3 mol L−1 of hydrochloric acid, 17.7 mL of hexafluorosilicic acid and 20 mL of hydrogen peroxide, an extraction of 58.3% of copperII ions was obtained in relation to the theoretical concentration present in the samples. Additionally, the leaching reaction generated pure hydrogen gas, according to gas chromatography analysis.
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