Microfluidic Packaging Integration with Electronic-Photonic Biosensors Using 3D Printed Transfer Molding

Multiplexed sensing in integrated silicon electronic-photonic platforms requires microfluidics with both high density micro-scale channels and meso-scale features to accommodate for optical, electrical, and fluidic coupling in small, millimeter-scale areas. Three-dimensional (3D) printed transfer mo...

詳細記述

書誌詳細
出版年:Biosensors
主要な著者: Christos Adamopoulos, Asmaysinh Gharia, Ali Niknejad, Vladimir Stojanović, Mekhail Anwar
フォーマット: 論文
言語:英語
出版事項: MDPI AG 2020-11-01
主題:
オンライン・アクセス:https://www.mdpi.com/2079-6374/10/11/177
その他の書誌記述
要約:Multiplexed sensing in integrated silicon electronic-photonic platforms requires microfluidics with both high density micro-scale channels and meso-scale features to accommodate for optical, electrical, and fluidic coupling in small, millimeter-scale areas. Three-dimensional (3D) printed transfer molding offers a facile and rapid method to create both micro and meso-scale features in complex multilayer microfluidics in order to integrate with monolithic electronic-photonic system-on-chips with multiplexed rows of 5 <inline-formula><math display="inline"><semantics><mi mathvariant="sans-serif">μ</mi></semantics></math></inline-formula>m radius micro-ring resonators (MRRs), allowing for simultaneous optical, electrical, and microfluidic coupling on chip. Here, we demonstrate this microfluidic packaging strategy on an integrated silicon photonic biosensor, setting the basis for highly multiplexed molecular sensing on-chip.
ISSN:2079-6374