APA引文

Xu, S., Wu, Y., Chen, B., Huang, P., Zhang, Z., Zhong, Y., . . . Du, K. (2022, April). Electrochemical Thin Film Deposition of Copper(I) Halides in Aqueous Solution: Substrate Extension and Structure Transformation. Advanced Materials Interfaces.

Chicago Style (17th ed.) Citation

Xu, Si‐Yu, Ya‐Nan Wu, Bi‐Cui Chen, Pei‐Wen Huang, Zhi‐Zhuan Zhang, Yu Zhong, Yi Zhao, Xiao‐Ying Huang, and Ke‐Zhao Du. "Electrochemical Thin Film Deposition of Copper(I) Halides in Aqueous Solution: Substrate Extension and Structure Transformation." Advanced Materials Interfaces Apr. 2022.

MLA引文

Xu, Si‐Yu, et al. "Electrochemical Thin Film Deposition of Copper(I) Halides in Aqueous Solution: Substrate Extension and Structure Transformation." Advanced Materials Interfaces, Apr. 2022.