A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material

With the increase in heat power density in modern integrating electronics, thermal interface materials (TIM) that can efficiently fill the gaps between the heat source and heat sinks and enhance heat dissipation are urgently needed owing to their high thermal conductivity and excellent mechanical du...

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Bibliographic Details
Published in:	Nanomaterials
Main Authors:	Le Lv, Junfeng Ying, Lu Chen, Peidi Tao, Liwen Sun, Ke Yang, Li Fu, Jinhong Yu, Qingwei Yan, Wen Dai, Nan Jiang, Cheng-Te Lin
Format:	Article
Language:	English
Published:	MDPI AG 2023-02-01
Subjects:	graphene paper Ag nanowires thermal interface materials
Online Access:	https://www.mdpi.com/2079-4991/13/5/793

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