| Summary: | Overcoming the strength–conductivity trade-off in Al2O3/Cu composites remains a key challenge. Here, we propose a microstructural design strategy that combines 〈0 0 1〉 texture with elongated ultrafine grains. Room-temperature rotary swaging (RS), assisted by the pinning effect of Al2O3 particles, promotes the selective formation of 〈0 0 1〉-oriented grains through compressive–shear deformation and enhances grain aspect ratios. The resulting structure provides texture-dominated conductive paths while reducing transverse grain boundary density. Consequently, the composite achieves a yield strength of 342 MPa and an electrical conductivity of 95.3 % IACS—representing a 56.8 % strength increase over the Cu matrix without sacrificing conductivity. This work demonstrates a scalable, room-temperature route to high-performance Cu-based composites with an exceptional strength–conductivity balance for advanced electrical applications.
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