Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching

This work aims to provide deep morphological observation on the incorporated TiO _2 nanoparticles within the SAC305 by selective electrochemical etching. Cyclic voltammetry and chronoamperometry were used to investigate the selective etching performances. The removal of β -Sn matrix was conducted at...

Full description

Bibliographic Details
Published in:	Materials Research Express
Main Authors:	Muhamad Zamri Yahaya, Muhammad Firdaus Mohd Nazeri, Soorathep Kheawhom, Balázs Illés, Agata Skwarek, Ahmad Azmin Mohamad
Format:	Article
Language:	English
Published:	IOP Publishing 2020-01-01
Subjects:	intermetallic compounds microstructure SAC reflow soldering TiO2 nanoparticles
Online Access:	https://doi.org/10.1088/2053-1591/ab6b57

Similar Items

Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering
by: Eun-Chae Noh, et al.
Published: (2024-11-01)

Microwave hybrid heating for lead-free solder: A review
by: Mardiana Said, et al.
Published: (2023-09-01)

The Effect of Multiple Solder Reflows on the Formation of Cu<sub>6</sub>Sn<sub>5</sub> Intermetallics and the Decomposition of SnAg3.0Cu0.5 Solder Joints in the Framework of Rework and Reuse of MLCC Components
by: Erik Wiss, et al.
Published: (2024-08-01)

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere
by: Siliang He, et al.
Published: (2022-11-01)

Microstructural and mechanical properties of Sn58Bi/Sn3.0Ag0.5Cu hybrid solder joints containing TiC nanoparticle additions
by: Kwan-Soo Lim, et al.
Published: (2025-11-01)

Mechanics of solder/IMC interface of lead-free solder interconnects in ball grid array assembly
by: S.F.M. Asasaari, et al.
Published: (2022-03-01)

In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu<sub>6</sub>Sn<sub>5</sub> Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage
by: Bingfeng Guo, et al.
Published: (2023-08-01)

The combined effect of reflow soldering time and Bi doping on the interfacial behavior and shear properties of Sn-0.7Cu-0.8Zn/Cu solders joint
by: Wenbin Tu, et al.
Published: (2025-05-01)

The Effect of Bi Addition on the Electromigration Properties of Sn-3.0Ag-0.5Cu Lead-Free Solder
by: Huihui Zhang, et al.
Published: (2024-10-01)

Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors
by: Mohamed Amine Alaya, et al.
Published: (2021-02-01)

MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY
by: Mohd Izrul Izwan RAMLI, et al.
Published: (2023-06-01)

First-principles and experimental investigations on the mechanical properties of Co particles modified Sn-1.0Ag-0.5Cu solder
by: Xing-yu Guo, et al.
Published: (2025-06-01)

Effect of electron irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints
by: Yang Liu, et al.
Published: (2024-05-01)

Vapour phase reflow soldering with vertical assembly stacking to improve productivity
by: Gergő Havellant, et al.
Published: (2025-03-01)

EFFECT ON MICROSTRUCTURAL AND PHYSICAL PROPERTIES OF Sn-3.0Ag-0.5Cu LEAD-FREE SOLDER WITH THE ADDITION OF SiC PARTICLES
by: Zawawi MAHIM, et al.
Published: (2019-03-01)

Research on Substrate Soldering of High-voltage IGBT Modules
by: 赵洪涛
Published: (2011-01-01)

Improving efficiency of vapour phase soldering ovens with pressure and temperature-based process monitoring
by: Gergő Havellant, et al.
Published: (2024-05-01)

Effects of ZrO<sub>2</sub> Nano-Particles’ Incorporation into SnAgCu Solder Alloys: An Experimental and Theoretical Study
by: Agata Skwarek, et al.
Published: (2024-10-01)

In situ study the effects of bias and electric field intensity on electrochemical migration behavior of Sn96.5Ag3.0Cu0.5 solder alloy
by: Pan Yi, et al.
Published: (2023-11-01)

Performance characterization of Au–Ge solder ball bumps fabricated via the Pulsated Orifice Ejection Method
by: Wei Dong, et al.
Published: (2025-09-01)

Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process
by: Jie Wu, et al.
Published: (2019-09-01)

Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder joints under thermal shock between 77 K and 423 K by adding TiO2 nanoparticles
by: Ruyu Tian, et al.
Published: (2024-03-01)

Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows
by: M.S. Chang, et al.
Published: (2023-09-01)

Overview of Different Approaches in Numerical Modelling of Reflow Soldering Applications
by: István Bozsóki, et al.
Published: (2023-08-01)

Effects of CuO nanoparticles on SAC composite solder joints: Microstructural and DFT study
by: Balázs Illés, et al.
Published: (2024-09-01)

Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO<sub>2</sub> Nanoparticles
by: Sri Harini Rajendran, et al.
Published: (2020-09-01)

Design and Performance Evaluation of Sn58Bi/SAC305 Layered Composite Solder for Low-Temperature Applications
by: Zhongxu Zhang, et al.
Published: (2025-02-01)

Comparative study on the bonding property of laser and reflow soldered Sn-3.0Ag-0.5Cu/Ni–P microbumps after isothermal aging and multiple reflowing
by: Yang Wu, et al.
Published: (2024-03-01)

The Impact of Baseplate Bow on Vacuum Reflow Soldering
by: 曾雄, et al.
Published: (2011-01-01)

Nanoparticle-reinforced solder alloys: A comprehensive review of recent formulation properties, and mechanical performance
by: Muhamad Zamri Yahaya, et al.
Published: (2024-09-01)

Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders
by: Nagy E., et al.
Published: (2015-06-01)

Reflow Soldering Capability Improvement by Utilizing TaN Interfacial Layer in 1Mbit RRAM Chip
by: Peng Yuan, et al.
Published: (2022-03-01)

Research on Baseplate Soldering Process of High-voltage IGBT Module
Published: (2011-01-01)

Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys
by: Agata Skwarek, et al.
Published: (2021-06-01)

To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints
by: Yan-Rong Huang, et al.
Published: (2023-05-01)

Nucleation and Morphology of Cu<sub>6</sub>Sn<sub>5</sub> Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate
by: Junhyuk Son, et al.
Published: (2021-01-01)

Strategies for inducing heredity of β-Sn texture in micro solder joints during multi-reflow process
by: Yuanyuan Qiao, et al.
Published: (2021-06-01)

Microstructural Evolution and Deterioration of Shear Properties of Sn3.0Ag0.5Cu/Cu Solder Joints after Long-Term Storage at Cryogenic Temperatures
by: Xiaotong Guo, et al.
Published: (2023-03-01)

Tensile properties dependency on crystal size and direction of single crystal Ag3Sn intermetallic compound: a molecular dynamics study
by: Md. Maruf Billah, et al.
Published: (2022-09-01)

Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders
by: Karel Dušek, et al.
Published: (2022-01-01)