Utilization of Neem Seed Oil as Surfactant in the Production of Flexible and Rigid Polyurethane Foam

• Published in: Emerging Technologies and Engineering Journal
• Main Authors: Habib Abba Sanda, Muhammad Abbagoni Abubakar, Abdulhalim Musa Abubakar, Mamman Bashir, Martin Stojchevski
• Format: Article
• Language: English
• Published: Engiscience Publisher 2024-10-01
• Subjects: polyurethane foam; surfactant; neem seed oil; polyol; diisocyanate; blowing agent
• Online Access: https://engiscience.com/index.php/etej/article/view/329

Extraction and processing of polyether polyols derived from petrochemicals, commonly used as surfactants during polyurethane foam (PUF) production, contribute to carbon emissions and raises the issue of long-term sustainability given that petrochemicals are non-renewable resources. Here, 5 mg and 4 mg of neem seed oil are employed to form flexible and rigid PUF, classified purposefully based on their divergent usage. To find an environmentally friendly replacement, flexible PUF whose mass, volume, density, compression, tensile strength, cream time, foam rise and rising time are 0.0047 kg m3, 16.52 kg/m3, 8.10%, 39.28 kN/m2, 60s, 10s and 60s is formed by mixing 1.25 kg polyol, 5mg silicon oil and 10g calcium carbonate (CaCO3). Likewise, by mixing 1.2 kg polyol, 4mg silicon oil and 8g CaCO3, a rigid PUF with 0.005kg,  m3, 16.2 kg/m3, 8.15%, 40.72 kN/m2, 50s, 15 cm and 58s key, physical and mechanical property as respectively listed under the flexible PUF formulation is produced. Both foams were produced using equal amounts of toluene diisocyanate, water, stannous octoate and methylene chloride, resulting in PUF that can be used in insulation, cushioning and construction support applications based on their characteristic height, density, tensile strength and compressive strength. As the surfactant, neem seed oil's potential in the synthesis of PUF cannot be overemphasized. The study of the kinetics of PUF production is limited and should trigger the adoption of biobased surfactants for industrial applications in the future.