MAHIM, Z., SALLEH, M. A. A. M., & SAUD, N. (2019, March). EFFECT ON MICROSTRUCTURAL AND PHYSICAL PROPERTIES OF Sn-3.0Ag-0.5Cu LEAD-FREE SOLDER WITH THE ADDITION OF SiC PARTICLES. European Journal of Materials Science and Engineering.
Chicago Style (17th ed.) CitationMAHIM, Zawawi, Mohd Arif Anuar MOHD SALLEH, and Norainiza SAUD. "EFFECT ON MICROSTRUCTURAL AND PHYSICAL PROPERTIES OF Sn-3.0Ag-0.5Cu LEAD-FREE SOLDER WITH THE ADDITION OF SiC PARTICLES." European Journal of Materials Science and Engineering Mar. 2019.
MLA (9th ed.) CitationMAHIM, Zawawi, et al. "EFFECT ON MICROSTRUCTURAL AND PHYSICAL PROPERTIES OF Sn-3.0Ag-0.5Cu LEAD-FREE SOLDER WITH THE ADDITION OF SiC PARTICLES." European Journal of Materials Science and Engineering, Mar. 2019.
Warning: These citations may not always be 100% accurate.