EFFECT ON MICROSTRUCTURAL AND PHYSICAL PROPERTIES OF Sn-3.0Ag-0.5Cu LEAD-FREE SOLDER WITH THE ADDITION OF SiC PARTICLES

The Lead-free solder has been subject of concentrated research activity over the past era, but it is hard to meet the characterization and mechanical properties of Sn-Pb solder. Sn-Ag-Cu and Sn-Cu family of alloys were the most ideal and capable among all the Pb-free solder alloys proposed. Much pub...

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Bibliographic Details
Published in:	European Journal of Materials Science and Engineering
Main Authors:	Zawawi MAHIM, Mohd Arif Anuar MOHD SALLEH, Norainiza SAUD
Format:	Article
Language:	English
Published:	Politehnium Publishing House 2019-03-01
Subjects:	powder metallurgy method sic microstructure microhardness sac lead-free solder
Online Access:	http://ejmse.tuiasi.ro/articles/EJMSE_04_01_05_Mahim.pdf

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