Wetting and the reaction of multiwalled carbon nanotube-reinforced composite solder with a copper substrate

In this work, contact angle, spreading area, and isothermal aging tests were conducted to study the difference between Sn-3Ag-0.5Cu lead-free solder and its composite solder at different multiwalled carbon nanotube reinforcement volume fractions. The material interaction between the solder and the s...

وصف كامل

التفاصيل البيبلوغرافية
الحاوية / القاعدة:	Science and Engineering of Composite Materials
المؤلفون الرئيسيون:	Huang Her-Yueh, Yang Chung-Wei, Pan Sian-Ze
التنسيق:	مقال
اللغة:	الإنجليزية
منشور في:	De Gruyter 2013-11-01
الموضوعات:	composite solder contact angle intermetallic compound isothermal aging multiwalled carbon nanotube
الوصول للمادة أونلاين:	https://doi.org/10.1515/secm-2012-0152

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