A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon
Precision processing of monocrystalline silicon presents significant challenges due to its unique crystal structure and chemical properties. Effective modeling and simulation are essential for advancing the understanding of the manufacturing process, optimizing design, and refining production parame...
| 發表在: | Micromachines |
|---|---|
| Main Authors: | Ansheng Li, Hongyan Wang, Shunchang Hu, Yu Zhou, Jinguang Du, Lianqing Ji, Wuyi Ming |
| 格式: | Article |
| 語言: | 英语 |
| 出版: |
MDPI AG
2024-08-01
|
| 主題: | |
| 在線閱讀: | https://www.mdpi.com/2072-666X/15/8/1041 |
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相似書籍
-
Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon
由: Ansheng Li, et al.
出版: (2023-07-01) -
Experimental Investigation of the Sawn Surface of Monocrystalline Silicon Cut by Endless Diamond Wire Sawing
由: Erick Cardoso Costa, et al.
出版: (2020-08-01) -
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由: Honghao Li, et al.
出版: (2025-06-01) -
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由: Jianyun Shen, et al.
出版: (2019-09-01) -
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由: Tengyun Liu, et al.
出版: (2022-11-01)
