Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
The reliability of printed circuit boards under dynamic loads is a key issue in the handheld electronic products industry. In order to predict the performance of the boards in their application lifetime, different tests were developed. The current industry-wide standard testing method is a board lev...
| الحاوية / القاعدة: | Fracture and Structural Integrity |
|---|---|
| المؤلفون الرئيسيون: | , |
| التنسيق: | مقال |
| اللغة: | الإنجليزية |
| منشور في: |
Gruppo Italiano Frattura
2013-04-01
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| الوصول للمادة أونلاين: | https://www.fracturae.com/index.php/fis/article/view/109 |
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Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
الحاوية / القاعدة Fracture and Structural Integrity
(2013-04-01)
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Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
الحاوية / القاعدة Fracture and Structural Integrity
(2011-01-01)
احصل على النص الكامل
مقال