APA (7th ed.) Citation

Ustad, R. E., Chavan, V. D., Kim, H., Shin, M., Kim, S., Choi, K., & Kim, D. (2023, September). Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films. Nanomaterials.

Chicago Style (17th ed.) Citation

Ustad, Ruhan E., Vijay D. Chavan, Honggyun Kim, Min-ho Shin, Sung-Kyu Kim, Kyeong-Keun Choi, and Deok-kee Kim. "Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films." Nanomaterials Sep. 2023.

MLA (9th ed.) Citation

Ustad, Ruhan E., et al. "Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films." Nanomaterials, Sep. 2023.