Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films

Photosensitive polyimides (PSPIs) have been widely developed in microelectronics, which is due to their excellent thermal properties and reasonable dielectric properties and can be directly patterned to simplify the processing steps. In this study, 3 μm~7 μm thick PSPI films were deposited on differ...

詳細記述

書誌詳細

出版年:	Nanomaterials
主要な著者:	Ruhan E. Ustad, Vijay D. Chavan, Honggyun Kim, Min-ho Shin, Sung-Kyu Kim, Kyeong-Keun Choi, Deok-kee Kim
フォーマット:	論文
言語:	英語
出版事項:	MDPI AG 2023-09-01
主題:	polyimide photosensitive Cu RDL resistivity advanced packaging
オンライン･アクセス:	https://www.mdpi.com/2079-4991/13/19/2642