Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

With the miniaturization of electronic packaging and devices, the size of solder joints in electronics is also decreasing from bulk solder joints to micro-bumps. Both the microstructure and mechanical properties of the solder joints are also evolving with the decreasing size, which brings great conc...

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Bibliographic Details
Published in:	Applied Sciences
Main Authors:	Shaobin Wang, Yao Yao, Xu Long
Format:	Article
Language:	English
Published:	MDPI AG 2019-01-01
Subjects:	size effect microstructure mechanical property solder joint
Online Access:	http://www.mdpi.com/2076-3417/9/2/227

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