Dynamic Recrystallization and Microstructural Evolution During Hot Deformation of Al-Cu-Mg Alloy
Isothermal hot compression tests were performed on an Al-4.8Cu-0.25Mg-0.32Mn-0.17Si alloy using a Gleeble-3500 thermomechanical simulator within the temperature range of 350–510 °C and strain rate range of 0.001–10 s<sup>−1</sup>, achieving a true strain of 0.9. The constitutive equation...
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2025-10-01
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| author | Fangyan He Xiaolan Wu Zhizheng Rong Xueqin Zhang Xiangyuan Xiong Shengping Wen Kunyuan Gao Wu Wei Li Rong Hui Huang Zuoren Nie |
| author_facet | Fangyan He Xiaolan Wu Zhizheng Rong Xueqin Zhang Xiangyuan Xiong Shengping Wen Kunyuan Gao Wu Wei Li Rong Hui Huang Zuoren Nie |
| author_sort | Fangyan He |
| collection | DOAJ |
| container_title | Metals |
| description | Isothermal hot compression tests were performed on an Al-4.8Cu-0.25Mg-0.32Mn-0.17Si alloy using a Gleeble-3500 thermomechanical simulator within the temperature range of 350–510 °C and strain rate range of 0.001–10 s<sup>−1</sup>, achieving a true strain of 0.9. The constitutive equation and hot processing maps were established to predict the flow behavior of the alloy. The hot deformation mechanisms were investigated through microstructural characterization using inverse pole figure (IPF), grain boundary (GB), and grain orientation spread (GOS) analysis. The results demonstrate that both dynamic recovery (DRV) and dynamic recrystallization (DRX) occur during hot deformation. At high <i>lnZ</i> values (high strain rates and low deformation temperatures), discontinuous dynamic recrystallization (DDRX) dominates. Under middle <i>lnZ</i> conditions (low strain rate or high deformation temperature), both continuous dynamic recrystallization (CDRX) and DDRX are the primary mechanisms. Conversely, at low <i>lnZ</i> values (low strain rates and high temperatures), CDRX and geometric dynamic recrystallization (GDRX) become predominant. The DRX process in the Al-Cu-Mg alloy is controlled by the deformation temperature and strain rate. |
| format | Article |
| id | doaj-art-ebfbb7dc6bab4d1f95fcb459be71246d |
| institution | Directory of Open Access Journals |
| issn | 2075-4701 |
| language | English |
| publishDate | 2025-10-01 |
| publisher | MDPI AG |
| record_format | Article |
| spelling | doaj-art-ebfbb7dc6bab4d1f95fcb459be71246d2025-10-28T16:51:09ZengMDPI AGMetals2075-47012025-10-011510110010.3390/met15101100Dynamic Recrystallization and Microstructural Evolution During Hot Deformation of Al-Cu-Mg AlloyFangyan He0Xiaolan Wu1Zhizheng Rong2Xueqin Zhang3Xiangyuan Xiong4Shengping Wen5Kunyuan Gao6Wu Wei7Li Rong8Hui Huang9Zuoren Nie10State Key Laboratory of Materials Low-Carbon Recycling, Beijing University of Technology, Beijing 100124, ChinaState Key Laboratory of Materials Low-Carbon Recycling, Beijing University of Technology, Beijing 100124, ChinaState Key Laboratory of Materials Low-Carbon Recycling, Beijing University of Technology, Beijing 100124, ChinaState Key Laboratory of Materials Low-Carbon Recycling, Beijing University of Technology, Beijing 100124, ChinaState Key Laboratory of Materials Low-Carbon Recycling, Beijing University of Technology, Beijing 100124, ChinaState Key Laboratory of Materials Low-Carbon Recycling, Beijing University of Technology, Beijing 100124, ChinaState Key Laboratory of Materials Low-Carbon Recycling, Beijing University of Technology, Beijing 100124, ChinaState Key Laboratory of Materials Low-Carbon Recycling, Beijing University of Technology, Beijing 100124, ChinaState Key Laboratory of Materials Low-Carbon Recycling, Beijing University of Technology, Beijing 100124, ChinaState Key Laboratory of Materials Low-Carbon Recycling, Beijing University of Technology, Beijing 100124, ChinaState Key Laboratory of Materials Low-Carbon Recycling, Beijing University of Technology, Beijing 100124, ChinaIsothermal hot compression tests were performed on an Al-4.8Cu-0.25Mg-0.32Mn-0.17Si alloy using a Gleeble-3500 thermomechanical simulator within the temperature range of 350–510 °C and strain rate range of 0.001–10 s<sup>−1</sup>, achieving a true strain of 0.9. The constitutive equation and hot processing maps were established to predict the flow behavior of the alloy. The hot deformation mechanisms were investigated through microstructural characterization using inverse pole figure (IPF), grain boundary (GB), and grain orientation spread (GOS) analysis. The results demonstrate that both dynamic recovery (DRV) and dynamic recrystallization (DRX) occur during hot deformation. At high <i>lnZ</i> values (high strain rates and low deformation temperatures), discontinuous dynamic recrystallization (DDRX) dominates. Under middle <i>lnZ</i> conditions (low strain rate or high deformation temperature), both continuous dynamic recrystallization (CDRX) and DDRX are the primary mechanisms. Conversely, at low <i>lnZ</i> values (low strain rates and high temperatures), CDRX and geometric dynamic recrystallization (GDRX) become predominant. The DRX process in the Al-Cu-Mg alloy is controlled by the deformation temperature and strain rate.https://www.mdpi.com/2075-4701/15/10/1100Al-4.8Cu-0.25Mg-0.32Mn-0.17Si alloyhot deformationhot processing mapsDRX mechanismmicrostructure evolution |
| spellingShingle | Fangyan He Xiaolan Wu Zhizheng Rong Xueqin Zhang Xiangyuan Xiong Shengping Wen Kunyuan Gao Wu Wei Li Rong Hui Huang Zuoren Nie Dynamic Recrystallization and Microstructural Evolution During Hot Deformation of Al-Cu-Mg Alloy Al-4.8Cu-0.25Mg-0.32Mn-0.17Si alloy hot deformation hot processing maps DRX mechanism microstructure evolution |
| title | Dynamic Recrystallization and Microstructural Evolution During Hot Deformation of Al-Cu-Mg Alloy |
| title_full | Dynamic Recrystallization and Microstructural Evolution During Hot Deformation of Al-Cu-Mg Alloy |
| title_fullStr | Dynamic Recrystallization and Microstructural Evolution During Hot Deformation of Al-Cu-Mg Alloy |
| title_full_unstemmed | Dynamic Recrystallization and Microstructural Evolution During Hot Deformation of Al-Cu-Mg Alloy |
| title_short | Dynamic Recrystallization and Microstructural Evolution During Hot Deformation of Al-Cu-Mg Alloy |
| title_sort | dynamic recrystallization and microstructural evolution during hot deformation of al cu mg alloy |
| topic | Al-4.8Cu-0.25Mg-0.32Mn-0.17Si alloy hot deformation hot processing maps DRX mechanism microstructure evolution |
| url | https://www.mdpi.com/2075-4701/15/10/1100 |
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