STRUCTURE AND techological improvments of tmbs diodes
An improved structure and technological process of trench MOS barrier Schottky (TMBS) diodes are developed and studied by 2D-simulation. The experiments performed demonstrated simplification of the technology by elimination of one photolithography and improvement of the diode parameters.
| الحاوية / القاعدة: | Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki |
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| المؤلفون الرئيسيون: | , , |
| التنسيق: | مقال |
| اللغة: | الروسية |
| منشور في: |
Educational institution «Belarusian State University of Informatics and Radioelectronics»
2019-06-01
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| الموضوعات: | |
| الوصول للمادة أونلاين: | https://doklady.bsuir.by/jour/article/view/199 |
| الملخص: | An improved structure and technological process of trench MOS barrier Schottky (TMBS) diodes are developed and studied by 2D-simulation. The experiments performed demonstrated simplification of the technology by elimination of one photolithography and improvement of the diode parameters. |
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| تدمد: | 1729-7648 |
