Delamination of Plasticized Devices in Dynamic Service Environments

With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging devices. In this paper, the delamination failure mech...

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Bibliographic Details
Published in:	Micromachines
Main Authors:	Wenchao Tian, Xuyang Chen, Guoguang Zhang, Yuanming Chen, Jijun Luo
Format:	Article
Language:	English
Published:	MDPI AG 2024-03-01
Subjects:	delamination moisture thermal stress RDL fillers block copolymer
Online Access:	https://www.mdpi.com/2072-666X/15/3/376

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