THERMOELECTRIC COOLING MODULE WITH DAMPING CONDUCTOR ON COLD SPAYS

• 出版年: Научно-технический вестник информационных технологий, механики и оптики
• 主要な著者: A. A. Kasyanov, K. L. Samusevich, G. N. Isachenko
• フォーマット: 論文
• 言語: 英語
• 出版事項: ITMO University 2019-03-01
• 主題: thermoelectricity; thermoelectric module; silicides; electrically conductive silicone; thermal expansion coefficient
• オンライン･アクセス: https://ntv.ifmo.ru/file/article/18598.pdf

Subject of Research.The paper presents results of study on a thermoelectric cooling module with damping heat and electrically conductive material for cold junctions. Telluride obtained by synthesis in a melting furnace is used as a thermoelectric element material. The size of a thermoelectric element is 2.0×2.0×1.5 mm. The modules were mounted on ceramic plates made of 96% Al2O3 with dimensions of 30×30×0.89 mm. Copper coated with a layer of nickel is used as the switching bus material. Modules were attached to the board by soldering. Tin and bismuth solder paste (melting point is equal to 139°С) was used as an assembly solder alloy. An electrically conductive EX-A302L silicone with specific resistance of 0.02 Ohm/cm, densityof 3.7 g/cm3 and thermal conductivity of 2.1 W/(m·K) was used for the damping compound. Methods. For efficiency increase of a thermal contact of a thermoelectric module, associated with large temperature gradient between hot and cold energy, especially for electrical n-elements, it is recommended to use an elastic electrically conductive adhesive. Elastic conductive adhesive based on silicone is proposed. Conductive silicone EX-A302L adhesive sealant consisted of single-component cold-vulcanized silicone with splashes of conductive microgranules. Working temperature from -50 to +120°C allows for the application of this adhesive both for conventional refrigeration modules, and for the cold junction of medium-temperature modules. A phased module assembly technology is developed. Main Results. Comparative tests are carried out for the experimental thermoelectric module and the standard industrial module of TB-31-2.0-1.5 thermoelectric module at measuring installations manufactured by Kryotherm company. The integrity of the modules was tested on Testo thermal imager. It is established that the difference between the working characteristics of experimental and industrial modules does not exceed 10% and lies within the permissible limits. It is found out that destruction dynamics of the modules after temperature cycling is virtually the same. Practical Relevance. The results obtained demonstrate the application possibility of electrically conductive adhesive as a contact layer for a thermoelement. The proposed technology will allow for replacing the materials of thermoelectric module branches with more efficient ones, but having different coefficients of temperature expansion, thereby increasing the efficiency of the thermoelectric device.