Search Results - INTEGRATED CIRCUIT PACKAGING

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  1. 1

    Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices by Lee Carroll, Jun-Su Lee, Carmelo Scarcella, Kamil Gradkowski, Matthieu Duperron, Huihui Lu, Yan Zhao, Cormac Eason, Padraic Morrissey, Marc Rensing, Sean Collins, How Yuan Hwang, Peter O’Brien

    Published in Applied Sciences (2016-12-01)
    Subjects: “…photonic integrated circuits (PICs)…”
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    Article


  2. 2

    Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages by Konstantin O. Petrosyants, Nikita I. Ryabov

    Published in Energies (2020-06-01)
    “…The problem of thermal modeling of modern three-dimensional (3D) integrated circuit (IC) systems in packages (SiPs) is discussed. …”
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    Article


  3. 3

    Photonic Integrated Circuits: Research Advances and Challenges in Interconnection and Packaging Technologies by Wenchao Tian, Yifan Wang, Haojie Dang, Huahua Hou, Yuanyuan Xi

    Published in Photonics (2025-08-01)
    Subjects: “…photonic integrated circuit…”
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    Article


  4. 4

    Current Status of the Integrated Circuit Industry in China ― Packaging and Testing Industry Review by Litho World

    Published in Journal of Microelectronic Manufacturing (2019-12-01)
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    Article


  5. 5

    RLC Circuit Forecast in Analog IC Packaging and Testing by Machine Learning Techniques by Jung-Pin Lai, Ying-Lei Lin, Ho-Chuan Lin, Chih-Yuan Shih, Yu-Po Wang, Ping-Feng Pai

    Published in Micromachines (2022-08-01)
    Subjects: “…integrated circuit…”
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    Article


  6. 6

    A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging by Haoyu Wang, Jianshe Ma, Yide Yang, Mali Gong, Qinheng Wang

    Published in Micromachines (2023-05-01)
    Subjects: “…integrated circuits…”
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    Article


  7. 7

    Packaging of micro-lens arrays to photonic integrated circuits using beam shape evaluation by Kamil Gradkowski, Padraic E Morrissey, Peter O’Brien

    Published in JPhys Photonics (2024-01-01)
    Subjects: “…photonic integrated circuits…”
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    Article


  8. 8

    Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package by Zahra Kolahdouz Esfahani, Massoud Tohidian, Henk van Zeijl, Mohammadreza Kolahdouz, Guoqi Zhang

    Published in IEEE Photonics Journal (2017-01-01)
    “…The feedback circuit was monolithically integrated in a package with four high-power blue LED chips. …”
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    Article


  9. 9

    A Novel Feature Extraction Algorithm and System for Flexible Integrated Circuit Packaging Substrate by Dan Huang, Juan Wang, Yong Zeng, Yongxing Yu, Yueming Hu

    Published in Micromachines (2022-02-01)
    Subjects: “…flexible integrated circuit packaging substrate…”
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    Article


  10. 10

    Study of heat transfer performance of miniature heat sink for integrated circuit packaging field by Zhaolong Li, Wangwang Li, Yingtao Liu, Meng Xun, Mengchen Yuan

    Published in Case Studies in Thermal Engineering (2023-09-01)
    “…The miniature heat sink is an essential component in integrated circuit packaging, playing a vital role in ensuring the stable and reliable performance of integrated circuits. …”
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    Article


  11. 11

    Integrated Circuit Packaging Recognition with Tilt Auto Adjustment using Deep Learning Approach by Loh Siu Hong, Teh Peh Chiong, Lee Yong Kang, Sim Jia Jia, Yeap Kim Ho

    Subjects: “…integrated circuit packaging type…”
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    Article


  12. 12

    Tree-Based Machine Learning Models with Optuna in Predicting Impedance Values for Circuit Analysis by Jung-Pin Lai, Ying-Lei Lin, Ho-Chuan Lin, Chih-Yuan Shih, Yu-Po Wang, Ping-Feng Pai

    Published in Micromachines (2023-01-01)
    Subjects: “…integrated circuit…”
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    Article


  13. 13

    WR‐3.4 multi‐mode waveguide module with single‐chip‐integrated array circuits by Yunkyeong Koh, Sanggeun Jeon, Moonil Kim

    Published in Electronics Letters (2024-04-01)
    Subjects: “…integrated circuit packaging…”
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    Article


  14. 14

    Laser Written Glass Interposer for Fiber Coupling to Silicon Photonic Integrated Circuits by A. Desmet, A. Radosavljevic, J. Missinne, D. Van Thourhout, G. Van Steenberge

    Published in IEEE Photonics Journal (2021-01-01)
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    Article


  15. 15

    Assembly of Fine-Pitch Package Integrated Circuits in a Laminated Transfer Process for E-Textile Applications by Yi Li, Thomas Greig, Abiodun Komolafe, Russel Torah, Steve Beeby

    Published in Engineering Proceedings (2024-02-01)
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    Article


  16. 16

    Feasibility Analysis of Using X-ray Inspection Systems for Assessing the Mass Thickness of Integrated Circuit Packages by Alexey S. Artamonov, Dmitry V. Boychenko, Anna S. Kameneva

    Subjects: “…information systems security, mass thickness, integrated circuit packages, x-ray inspection system, nica nuclotron.…”
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    Article


  17. 17

    A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis by Jintao Wang, Fangcheng Duan, Ziwen Lv, Si Chen, Xiaofeng Yang, Hongtao Chen, Jiahao Liu

    Published in Applied Sciences (2023-07-01)
    Subjects: “…integrated circuits…”
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    Article


  18. 18

    Robust Inspection of Integrated Circuit Substrates Based on Twin Network With Image Transform and Suppression Modules by Eunjeong Choi, Jeongtae Kim

    Published in IEEE Access (2023-01-01)
    Subjects: “…integrated circuit substrate…”
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    Article


  19. 19

    Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications by Kai Werum, Wolfgang Eberhardt, Dieter Reenaers, Thomas Mager, Mika Endl, André Zimmermann, Wim Deferme

    Published in Micromachines (2025-08-01)
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    Article


  20. 20

    Design and Simulation of a Second-Order Universal Switched- Capacitor Filter as a 10-Pin Dual-In-Line Package Integrated Circuit by Abdul Kareem K. A. Raheem, Salam Waley Shneen, Manal Hadi Jaber, Ahmed H. Reja

    Published in Engineering and Technology Journal (2012-10-01)
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    Article


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