Towards Embroidered Circuit Board From Conductive Yarns for E-Textiles

Towards Embroidered Circuit Board From Conductive Yarns for E-Textiles

In this study, polymeric/metallic yarns were fabricated by using the micrometric copper multifilament and the polymer multifilament to create electrically conductive, thin, flexible composite yarn structures. The main aim is to realize the circuit board by using fabricated conductive yarns in the ne...

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Bibliographic Details
Main Authors: Ezgi Ismar, Xuyuan Tao, Francois Rault, Francois Dassonville, Cedric Cochrane
Format: Article
Language:English
Published: IEEE 2020-01-01
Series:IEEE Access
Subjects:
Conductive yarn
e-textiles
electronic circuits
embroidery process
textile industry
textile products
Online Access:https://ieeexplore.ieee.org/document/9174713/

Internet

https://ieeexplore.ieee.org/document/9174713/

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