Transient Process Optimization for Dual-Arm Cluster Tools With Wafer Revisiting

Transient Process Optimization for Dual-Arm Cluster Tools With Wafer Revisiting

In wafer fabrication, it is imperative to minimize the transient process of cluster tools for the sake of on-demand and preventive maintenance. Due to the trend of multi-type and small-batch production, transient processes appear more and more frequently. Thus, the optimization problems of transient...

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Bibliographic Details
Main Authors: Jipeng Wang, Hesuan Hu, Chunrong Pan, Liang Li
Format: Article
Language:English
Published: IEEE 2021-01-01
Series:IEEE Access
Subjects:
Cluster tool
semiconductor manufacturing
wafer fabrication
scheduling
transient process
wafer revisiting
Online Access:https://ieeexplore.ieee.org/document/9389780/

Internet

https://ieeexplore.ieee.org/document/9389780/

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