Transient current technique for charged traps detection in silicon bonded interfaces
Wafer bonding is an established technology for the manufacturing of silicon-on-insulator (SOI) substrates, micro-electromechanical systems (MEMS) and microfluidic devices. Low temperature direct bonding techniques can be of particular interest for the fabrication of monolithic radiation sensors. Suc...
| Main Authors: | , , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2019-02-01
|
| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/1.5079999 |