Transient current technique for charged traps detection in silicon bonded interfaces

Wafer bonding is an established technology for the manufacturing of silicon-on-insulator (SOI) substrates, micro-electromechanical systems (MEMS) and microfluidic devices. Low temperature direct bonding techniques can be of particular interest for the fabrication of monolithic radiation sensors. Suc...

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Bibliographic Details
Main Authors: J. Bronuzzi, D. Bouvet, C. Charrier, F. Fournel, M. F. García, A. Mapelli, M. Moll, E. Rouchouze, J. M. Sallese
Format: Article
Language:English
Published: AIP Publishing LLC 2019-02-01
Series:AIP Advances
Online Access:http://dx.doi.org/10.1063/1.5079999