A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles
Electronic yarns (E-yarns) contain electronics fully incorporated into the yarn’s structure prior to textile or garment production. They consist of a conductive core made from a flexible, multi-strand copper wire onto which semiconductor dies or MEMS (microelectromechanical systems) are so...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-01-01
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| Series: | Fibers |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-6439/7/2/12 |