Electromagnetic compatibility modeling for integrated circuits
The integrated circuit (IC) packaging electromagnetic compatibility (EMC)/signal integrity (SI)/power integrity (PI) problems have been broadly attested. But IC packaging electromagnetic interference (EMI) was seldom addressed. Because the electromagnetic emission from IC packagings becomes more cri...
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| Language: | English |
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The University of Hong Kong (Pokfulam, Hong Kong)
2014
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| Online Access: | http://hdl.handle.net/10722/206335 |