The Optimized Analysis and the Development of Design Module for the Wire Sweep of IC Encapsulation
碩士 === 中原大學 === 機械工程研究所 === 86 === IC plastic encapsulation often uses epoxy molding compounds to fill the IC cavities. Drag force from the molding compound during the transferring process is the most dominant factors that cause the sweep of wire. As the degree of sweep exceed some certain value, d...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/03948747098438561703 |