Effect of temperature on thermomigration of composite 95%Pb5%Sn-eutectic SnPb solder joints in flip chip technology
碩士 === 國立清華大學 === 工程與系統科學系 === 101 === Thermomigration in flip chip solder joints accompanied by electromigration had been reported in several years; however, not many studies focus on the influence of ambient temperature on thermomigration of solder joints. To understand how ambient temperature aff...
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| Format: | Others |
| Language: | en_US |
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2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/83613162331337345336 |