Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process

Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process

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This paper presents the investigation of the effects of epoxy moulding compound' (EMC) viscosity on the FSI aspects during moulded underfill process (MUF). Finite volume (FV) code and finite element (FE) code were connected online through the Mesh-based Parallel Code Coupling Interface (MpCCI)...

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Main Authors: Abdul Aziz, M.S (Author), Abdullah M.A.B (Author), Abdullah, M.Z (Author), Bin Abd Rahim S.Z (Author), bin Ghazali M.F (Author), Ishak, M.I (Author), Jamalludin, M.R (Author), Khor, C.Y (Author), Mat Saad M.N (Author), Muhammad Suandi M.E (Author), Rosli, M.U (Author), Yamin, A.F.M (Author), Zakaria, M.S (Author)
Format: Article
Language:English
Published: EDP Sciences 2017
Subjects:
C (programming language)
Castro-macosko models
Chip deformations
Codes (symbols)
Current simulation
Deformation
Deformation and stress
Finite element codes
Finite element method
Flip chip devices
Fluid structure interaction
Integrated circuits
Mesh-based parallel code coupling interfaces
Real-time prediction
Soldering
Underfill process
Viscosity
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