Search Results - Sen Cong

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  1. 1

    Reliability and prediction of Sn36Pb2Ag solder joints under thermal aging test by Sen Cong, Peng Liu, Shaobin Wang, Jinghua Xiong

    Published in Materials Research Express (2023-01-01)
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  2. 2

    Long-term storage life prediction and growth kinetics of intermetallic compounds in 62Sn36Pb2Ag solder joints by He ZHANG, Jia-yun FENG, Sen CONG, Shang WANG, Rong AN, Lang WU, Yan-hong TIAN

    Published in 工程科学学报 (2023-03-01)
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  3. 3

    Growth kinetics of (CuxNi1-x)6Sn5 intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test by Sen Cong, Weiwei Zhang, He Zhang, Peng Liu, Xingwen Tan, Lang Wu, Rong An, Yanhong Tian

    Published in Materials Research Express (2021-01-01)
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