Reliability and prediction of Sn36Pb2Ag solder joints under thermal aging test
In this work, the capacitor solder joints were aged at 50 °C, 75 °C, 100 °C, 125, and 150 °C from 100 h to 1000 h. The intermetallic compounds (IMCs) layer growth of Sn36Pb2Ag on hot air solder leveled (HASL) pad and electroless nickel/immersion gold (ENIG) pad was measured. Based on the empirical p...
| 出版年: | Materials Research Express |
|---|---|
| 主要な著者: | , , , |
| フォーマット: | 論文 |
| 言語: | 英語 |
| 出版事項: |
IOP Publishing
2023-01-01
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| 主題: | |
| オンライン･アクセス: | https://doi.org/10.1088/2053-1591/acca6d |