Enhanced thermal conductivity for traditional epoxy packaging composites by constructing hybrid conductive network
A cost-efficient and practical strategy was developed for preparing high thermal conductive epoxy packaging composites. The effective conductive network was constructed by the bridging effect between boron nitride (BN) and spherical silica (SiO _2 ). Compared to the epoxy (EP) composites with random...
| Published in: | Materials Research Express |
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| Main Authors: | , , |
| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2020-01-01
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| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/ab99e8 |