3D Printed Alumina for Geometrically-Complex Electronic Substrates With High-Performance Printed Conductors

Traditional high performance electronic substrates are currently fabricated with molds and screens by stacking punched green ceramic tapes and selectively screen printing electrical interconnects with silver-particle pastes and inks. The structures are spatially registered and stacked, then subseque...

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Bibliographic Details

Published in:	IEEE Access
Main Authors:	Alexander Gomez, Bharat Yelamanchi, Alexis Maurel, Ana C. Martinez, Thomas Feldhausen, Jayaprakash Shivakumar, Eduardo Rojas, Yirong Lin, Pedro Cortes, Eric MacDonald, David A. Roberson
Format:	Article
Language:	English
Published:	IEEE 2024-01-01
Subjects:	3D printed alumina 3D printed electronics additive manufacturing ceramics conductive silver inks dielectric alumina
Online Access:	https://ieeexplore.ieee.org/document/10577763/