Fine pitch superconducting interconnects obtained with Nb–Nb direct bonding

For cryogenic systems, the development of superconducting interconnects is nowadays essential to reach large-scale integration schemes while addressing the associated challenges of signal dispersion and cross talk as well as thermal management. To achieve interconnects with micrometer and potentiall...

وصف كامل

التفاصيل البيبلوغرافية
الحاوية / القاعدة:Materials for Quantum Technology
المؤلفون الرئيسيون: Candice Thomas, Pablo Renaud, Meriem Guergour, Edouard Deschaseaux, Christophe Dubarry, Jennifer Guillaume, Elisa Vermande, Alain Campo, Frank Fournel, Hadi Hijazi, Anne-Marie Papon, Catherine Pellissier, Jean Charbonnier
التنسيق: مقال
اللغة:الإنجليزية
منشور في: IOP Publishing 2025-01-01
الموضوعات:
3D integration
superconducting interconnect
direct bonding
low temperature electrical characterizations
الوصول للمادة أونلاين:https://doi.org/10.1088/2633-4356/adaeff

الانترنت

https://doi.org/10.1088/2633-4356/adaeff

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