Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint

Extreme temperature change has generally been the great challenge to spacecraft electronic components, particularly in long, periodic, deep-space exploration missions. Hence, researchers have paid more attention to the reliability of component packaging materials. In this study, the microstructure e...

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發表在:	Metals
Main Authors:	Ziyi Wang, Songbai Xue, Weimin Long, Bo Wang, Jianhao Wang, Peng Zhang
格式:	Article
語言:	英语
出版:	MDPI AG 2020-10-01
主題:	Au-12Ge solder joint extreme thermal shock microstructure mechanical properties fracture behavior
在線閱讀:	https://www.mdpi.com/2075-4701/10/10/1373