The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction
This study aimed to investigate the effects of the addition of Bi and Zn on the mechanical properties of Sn-Ag-Cu lead-free alloy frequently used as a soldering material in the semiconductor packaging process. To reduce the Ag content of the commercial alloy SAC305 (Sn-3Ag-0.5Cu) by 1 wt.%, Bi and Z...
| الحاوية / القاعدة: | Metals |
|---|---|
| المؤلفون الرئيسيون: | , , , |
| التنسيق: | مقال |
| اللغة: | الإنجليزية |
| منشور في: |
MDPI AG
2022-07-01
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| الموضوعات: | |
| الوصول للمادة أونلاين: | https://www.mdpi.com/2075-4701/12/8/1245 |