TECHNOLOGY OF LASER CUTTING OF SILICON WAFERS INTO ORGANIC LIGHT-EMITTING DIODE CHIPS

The article deals with the matter of crystal quality in the production of microdisplays based on organic light-emitting diodes (OLEDs) after separation. This work aimed at increasing the product yield in cutting a silicon device wafer into chips by a method based on laser controlled thermocracking (...

詳細記述

書誌詳細

出版年:	Российский технологический журнал
主要な著者:	V. S. Kondratenko, V. I. Ivanov
フォーマット:	論文
言語:	ロシア語
出版事項:	MIREA - Russian Technological University 2016-06-01
主題:	ferroelectric thin film pzt modeling disturbed layer dead layer
オンライン･アクセス:	https://www.rtj-mirea.ru/jour/article/view/20