Study of Microstructure and Mechanical Properties of Electrodeposited Cu on Silicon Heterojunction Solar Cells

This study investigated the use of a pure copper seed layer to improve the adhesion strength and reduce the residual stress of electroplated copper films for heterojunction technology in crystalline solar cells. The experiment involved depositing a copper seed layer and an indium tin oxide (ITO) lay...

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Bibliographic Details

Published in:	Metals
Main Authors:	Jeff Shan, Chung-Hsuan Shan, Craig Huang, Yu-Ping Wu, Yuan-Kai Lia, Wen-Jauh Chen
Format:	Article
Language:	English
Published:	MDPI AG 2023-07-01
Subjects:	copper heterojunction technology microstructure residual stress adhesion strength
Online Access:	https://www.mdpi.com/2075-4701/13/7/1223