Electromagnetic compatibility technologies based on multi-functional spoof surface plasmon polariton channels

High integration of modern microwave circuits and systems puts forward higher requirements for multi-function and electromagnetic compatibility (EMC) performance of transmission channels. In this paper, we propose two EMC technologies including the substrate integrated packaging (SIP) and tuneable w...

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Bibliographic Details

Published in:	JPhys Photonics
Main Authors:	Ling Yun Niu, Hao Chi Zhang, Pei Hang He, Yi Fan, Le Peng Zhang, Tie Jun Cui
Format:	Article
Language:	English
Published:	IOP Publishing 2023-01-01
Subjects:	spoof surface plasmon polaritons (SSPPs) electromagnetic compatibility (EMC) multi-function substrate integrated packaging technology tuneable wavenumber mismatching technology
Online Access:	https://doi.org/10.1088/2515-7647/acacda